Ismosys represents Versarian Technologies in Europe

    

Versarien plc, the advanced engineering materials group, has appointed Ismosys as the pan European sales and marketing partner for Versarien Technologies Limited, the Company’s subsidiary which specialises in advanced thermal management solutions.

The partnership with Ismosys will extend the sales and marketing reach, and customer support, for the VersarienCu^TMstandard range of heat sink products.  Ismosys has sales representatives based in a number of key European territories, managed from eight regional offices. Ismosys also has an established relationship with Mouser Electronics, one of Versarien’s existing global distribution partners.

The Nordic region is currently witnessing a surge in its high-tech electronics industries, which is being created by a burgeoning start-up community and a highly skilled engineering workforce. This new wave of creativity and design is leading to a strong demand for innovative components such as the VersarienCu^TM micro-porous metallic copper foam technology, where space is at a premium and performance is crucial.

Neill Ricketts, CEO of Versarien, said: “We continue to expand our geographical presence outside the UK and to make further progress in the commercialisation of our disruptive technology.  Since launching our standard range of heat sink products in April we have secured a global distribution agreement in the US with Mouser Electronics.  We anticipate that this latest partnership will provide us with considerable reach into Europe and the fast evolving Nordic electronic market.  Our product range is ideally suited for the next generation of electronic devices and securing these sales channels demonstrates that we are gaining real momentum.”

About the VersarienCU^TM heat sink range

The low profile range is designed for use in passive cooling applications where space is at a premium and performance is crucial. VersarienCu^TM heat sinks can potentially be used to cool any Integrated Circuit component, with applications including:

• Power integrated circuits, high temperature components and transistors
• Set top boxes, AP routers, cable modems and broadband
• Optical Networks and LED TV and flat panel displays

VersarienCu^TM reduces the potential size requirement of individual components due to increased thermal efficiency.  Where space has traditionally been at a premium the metallic foam now allows for a reduced footprint.  The increased thermal efficiency of the copper foam on the component can allow for a cooling fan to be removed from products, and has the additional major benefit of increasing the life of a component by reducing overheating.

By producing a standard range of off-the-shelf products Versarien is offering this advanced cooling technology to customers at a more competitive price which, together with the improved thermal management capabilities has already resulted in significant interest from large scale users, who are looking for more reliability and functionality for their electronic components.

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