Micro Audio Components Address the Challenges of Miniaturization

//Micro Audio Components Address the Challenges of Miniaturization

Micro Audio Components Address the Challenges of Miniaturization

Micro Audio CUI

The miniaturization of electronic applications is certainly not a new trend. Over the past few decades, we have seen computers transform from space-consuming giants into powerful, pocket-sized devices. The ability to place more intelligence into increasingly smaller packages can be attributed in large part to the observations of Moore’s Law. This law states that the number of transistors in a dense integrated circuit (IC) doubles approximately every two years, meaning that more processing power can be packed into ever smaller applications. However, these ICs are only one piece of this shrinking puzzle. The other components that play an important role in mobile/medical devices and consumer electronics, including speakers and buzzers, must keep up with this trend as well.

Audio components in our smartphones, smartwatches and other consumer electronics have to continue to fit into smaller footprints without decreasing performance. Even medical devices, which are increasingly becoming more portable, must perform in potentially life-saving situations to the same standards as their full-sized counterparts.

Consumers have played a major role in the miniaturization of these electronic devices. Everyone wants more speed, more reliability, in the convenience of a compact package without sacrificing any aspects of the device’s performance. Companies and manufacturers of these devices are constantly innovating and looking to grow their businesses by building highly differentiated products to match consumer demand. All of this increased demand inherently puts added pressure on design engineers to find manufacturers of component-level solutions to match the design requirements of smaller applications.

CUI Inc is one such manufacturer that has worked to alleviate some of that pressure put on engineers by developing a line of micro buzzers and speakers for portable applications to meet the challenges of miniaturization head on.

CUI’s line of magnetic and piezo transducer micro buzzers are housed in a compact, surface mount package as small as 4 mm x 4 mm and profiles starting at 1.9 mm, addressing the major challenge of miniaturization. Even with the compact package, these micro buzzers don’t lack on performance with sounds pressure levels ranging from 65 dB up to 80 dB at 10 cm, making them ideal for a variety of consumer electronics, medical devices and industrial applications.

In addition to micro buzzers, CUI’s line of compact, low-profile micro speakers are housed in packages as small as 10 mm wide with profile depths as low as 2 mm. The micro speakers offer sound pressure levels ranging from 78 dB up to 93 dB and a variety of mounting options to plug into the specific needs of an engineer’s design, whether that be for household electronics, security or mobile devices and more.

Engineers face a number of pressures and the drive of companies to keep up with the trends of Moore’s Law and miniaturization does not make their jobs any easier. However, manufacturers like CUI with their micro speakers, buzzers and component-level solutions can provide a small, yet crucial piece to address the miniaturization challenge.

Interested?

Head over to the CUI page to request samples of audio products, view further information or to speak to a member of the team about incorporating CUI micro audio technologies into your designs.

By | 2016-10-13T19:13:39+00:00 July 27th, 2016|CUI|Comments Off on Micro Audio Components Address the Challenges of Miniaturization

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