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So far Ismosys has created 39 blog entries.

Industry first SFP+ line of products enabling connectivity for 2.5, 5 and 10GBASE-T networking released by Aquantia

New Multi-Gigabit Copper SFP+ modules provide a new dimension of flexibility for network and data center professionals looking to optimize equipment & reduce operating costs Aquantia Corp., pioneer and market leader in high-speed Ethernet connectivity solutions for data centers and enterprise infrastructure, today announced the industry’s first copper SFP+ product family to offer 2.5, 5 [...]

By | 2016-10-13T19:13:36+00:00 August 25th, 2016|Aquantia|Comments Off on Industry first SFP+ line of products enabling connectivity for 2.5, 5 and 10GBASE-T networking released by Aquantia

Efficient Power Conversion (EPC) reliability report documents GaN technology reliability

Download the full report today Place Place Efficient Power Conversion (EPC) Publishes Reliability Report Documenting GaN Technology Reliability After Millions of Device Hours of Rigorous Stress Testing EPC's Phase Eight Reliability Report documents a combined total of over 8 million GaN device-hours with zero failures. The report examines, in detail, the stress tests that [...]

By | 2016-10-13T19:13:39+00:00 August 2nd, 2016|EPC|Comments Off on Efficient Power Conversion (EPC) reliability report documents GaN technology reliability

Efficient Power Conversion (EPC) announces Ismosys as European partner

Ismosys now represents Efficient Power Conversion (EPC) in European sales, marketing, and technical support to assist customers in adopting eGaN® FETs and ICs for leading-edge power conversion systems using gallium nitride To support its accelerating growth throughout Europe, Efficient Power Conversion Corporation (EPC) has announced the appointment of Ismosys as its sales, marketing, and technical [...]

By | 2016-10-13T19:13:39+00:00 July 27th, 2016|EPC, Ismosys|Comments Off on Efficient Power Conversion (EPC) announces Ismosys as European partner

Microcontrollers from Microchip for low power, embedded security applications

Microchip's 16-bit, PIC24 MCUs and dsPIC® Digital Signal Controllers provide designers with an easy upgrade path from 8-bit PIC® microcontrollers and a cost effective option to 32-bit MCUs. The broad product line includes everything from eXtreme Low Power microcontrollers to high performance digital signal controllers. With single cycle execution, deterministic interrupt response, zero overhead looping, and [...]

By | 2016-10-13T19:13:39+00:00 July 20th, 2016|Microchip|Comments Off on Microcontrollers from Microchip for low power, embedded security applications

ATS How to series: Is Zipper Fin Best?

In our final post of this how to series from Advanced Thermal Solutions we take a slightly different spin on things. This video discusses Zipper Fin for cost effective, high volume deployment while discussing Zipper Fin in contrast with other available heat sink technologies. More... ATS How-to series How to Make a Thermocouple How to [...]

By | 2017-04-24T13:20:26+00:00 July 14th, 2016|ATS|Comments Off on ATS How to series: Is Zipper Fin Best?

Aquantia release second-generation AQrate ethernet chip

Aquantia already leads the industry in NBASE-T ethernet chip design experience, having deployed six generations of 10Gigabit and Multi-Gigabit BASE-T products across multiple process nodes. Over the past two years, Aquantia has leveraged this experience to develop the second-generation AQrate devices, which feature the industry’s smallest footprint and highest level of functionality. Aquantia is still [...]

By | 2016-10-13T19:13:39+00:00 July 8th, 2016|Aquantia|Comments Off on Aquantia release second-generation AQrate ethernet chip

ATS How to series: How to Apply Thermal Interface Material: Thermal Tape

This is the 3rd post in the ATS how to series. In this week's post, we have a really quick video about applying thermal tape to your heat sinks - Perfect if you have never done this before. More... ATS How-to series How to Make a Thermocouple How to Remove Thermal Interface Material from a [...]

By | 2017-04-24T13:20:54+00:00 July 6th, 2016|ATS|Comments Off on ATS How to series: How to Apply Thermal Interface Material: Thermal Tape

ATS How to series: How to Remove Thermal Interface Material from a Heat Sink

Welcome back to the Advanced Thermal Solutions how to series. In this week's post Greg is back, this time showing us how to removal thermal interface materials from a heat sink. In this video, ATS cover 3 materials - Thermal tape, phase change material and thermal grease. More... ATS How-to series How to Make a [...]

By | 2016-10-13T19:13:45+00:00 June 29th, 2016|ATS|Comments Off on ATS How to series: How to Remove Thermal Interface Material from a Heat Sink

ATS How to series: How to Make a Thermocouple

Ismosys are hosting a series of how to videos from thermal management specialist Advanced Thermal Solutions. In this week's video, in just 3 minutes Greg from ATS will demonstrate how to make a Thermocouple, a simple cost effective way to measure temperature that you can put together yourself. Like this? Check out more resources from [...]

By | 2016-10-13T19:13:45+00:00 June 23rd, 2016|ATS|Comments Off on ATS How to series: How to Make a Thermocouple

Thermal management videos – Webinars from ATS

Advanced Thermal Solutions (ATS) run a series of training webinars to assist designers and engineers when considering thermal management and regulation. Check out this series of recorded webinars from ATS on thermal interface materials, selecting heat sinks and thermal modelling. Using thermal interface materials to improve heat sink thermal performance To cool hotter components, engineers [...]

By | 2016-10-13T19:13:45+00:00 June 16th, 2016|ATS|Comments Off on Thermal management videos – Webinars from ATS
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