Axtrinet Ethernet Packet Generators – Your perfect on-desk testing solution

Xentech Solutions Ltd, one of our design partners, has launched Axtrinet™, the Ethernet packet generator focusing on simplicity and back to basic engineering. Designed to meet the needs of ‘Ethernet everywhere’ and the infrastructure behind the Internet of Things, Axtrinet is well suited to Research & Development applications, test and manufacturing environments. 40 Gbps and [...]

By | January 13th, 2017|Ismosys|Comments Off on Axtrinet Ethernet Packet Generators – Your perfect on-desk testing solution

Microchip Masters workshop days

    Do you design with Microchip products? Microchip Masters workshop days provide engineers with a space to meet other, like-minded engineers and learn and develop across the Microchip product range. Microchip offer their workshops, conferences and training days in locations in the United Kingdom, Germany, France and Italy. Q1 2017 highlights include: Developing with [...]

By | January 9th, 2017|Microchip|Comments Off on Microchip Masters workshop days

Learn from ATS: The ultimate heat pipe guide

Selection for performance Heat Pipes are often called Heat Superconductors! In this engineering article we’ll talk about heat pipes, how they are made, compare them with heat sinks, and talk about performance in various thermal management applications. Figure 1 Schematic View of a Heat Pipe [1] Heat pipes are transport mechanisms that can carry heat fluxes [...]

By | January 9th, 2017|ATS|Comments Off on Learn from ATS: The ultimate heat pipe guide

Future proofing your designs – External power supplies and efficiency standards

- With new legislation emerging at a fairly rapid pace, designers are faced with numerous challenges when ensuring that designs featuring external power supplies are compliant with the various standards in existence today. Only recently have we seen the implementation of Level VI standards in the US, but in Europe CoC Tier 1 [...]

By | October 21st, 2016|CUI|Comments Off on Future proofing your designs – External power supplies and efficiency standards

New Line of USB 2.0 and 3.0 Connectors Expands CUI’s Interconnect Portfolio

CUI’s Components Group have announced an expansion to its existing portfolio of power, audio and signal connectors with the addition of a USB product line. The new connector family incorporates USB 2.0 and 3.0 connectors available in Type A, Type B, Micro AB, Micro B, Mini AB and Mini B USB versions. Able to support [...]

By | October 19th, 2016|CUI|Comments Off on New Line of USB 2.0 and 3.0 Connectors Expands CUI’s Interconnect Portfolio

Ismosys and VCC announce strategic pan-european partnership

VCC is committed to growing its European footprint and increasing its value-added services and resources to help customers meet a wide range of illumination and indication requirements… VCC Enhances its Design and Customer Support Services in Europe Through Strategic Partnership with Ismosys. VCC, the global leader in indication and specialty illumination solutions, has partnered with [...]

By | October 19th, 2016|VCC|Comments Off on Ismosys and VCC announce strategic pan-european partnership

CUI’s External Ac-Dc Power Supplies Now Meet EU’s CoC Tier 2 Efficiency Standards

CUI have announced that the majority of its line of external ac-dc power supplies now meet the European Union’s (EU) Code of Conduct (CoC) Tier 1 and CoC Tier 2 efficiency standards. The European Union’s CoC Tier 1 effectively harmonizes the EU with US DoE Level VI and became effective as a voluntary requirement from January [...]

By | September 28th, 2016|CUI|Comments Off on CUI’s External Ac-Dc Power Supplies Now Meet EU’s CoC Tier 2 Efficiency Standards

ISSI launches the Next Generation family of Matrix FxLED Driver ICs

IS31FL3733, IS31FL3736 & IS31FL3737 drive up to 192 LEDs and support individual LED lighting effect functions for creating a configurable array of color animation visuals with Fault reporting Integrated Silicon Solution, Inc., a leader in advanced memory and analog IC solutions, today announced a family of high performance LED drivers, IS31FL3733, IS31FL3736 & IS31FL3737 to [...]

By | September 23rd, 2016|ISSI|Comments Off on ISSI launches the Next Generation family of Matrix FxLED Driver ICs

ISSI 4Gbit DDR4 DRAM for industrial, automotive, and communications markets

Integrated Silicon Solution, Inc. (ISSI), a leader in advanced memory solutions, have  announced the IS25LP256D (3V) and IS25WP256D (1.8V), the newest 256Mb member of its Serial NOR Flash family. These high performance products feature read speeds up to 166 MHz in Single/Dual/Quad I/O and 80 MHz in double data rate (DTR/DDR) modes, delivering read performance [...]

By | September 15th, 2016|ISSI|Comments Off on ISSI 4Gbit DDR4 DRAM for industrial, automotive, and communications markets

ISSI Introduces Automotive Grade 256Mb SPI NOR Flash with 166 MHz Multi I/O SPI and DTR modes

Integrated Silicon Solution, Inc. (ISSI), a leader in advanced memory solutions, today announced the IS25LP256D (3V) and IS25WP256D (1.8V), the newest 256Mb member of its Serial NOR Flash family. These high performance products feature read speeds up to 166 MHz in Single/Dual/Quad I/O and 80 MHz in double data rate (DTR/DDR) modes, delivering read performance [...]

By | September 9th, 2016|ISSI|Comments Off on ISSI Introduces Automotive Grade 256Mb SPI NOR Flash with 166 MHz Multi I/O SPI and DTR modes
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