Recent Articles

From ATS: Integral Modeling Is First Step for ATS Engineers

[fusion_vimeo id="111766690" width="" height="" autoplay="false" api_params="" hide_on_mobile="small-visibility,medium-visibility,large-visibility" class=""][/fusion_vimeo]   In July, Future Facilities, a CAD software company, released the results of a survey it...

Learn from ATS: The ultimate heat pipe guide

Selection for performance Heat Pipes are often called Heat Superconductors! In this engineering article we'll talk about heat pipes, how they are made, compare them with heat sinks, and talk about performance in various thermal management applications. While reading...

ATS How to series: Is Zipper Fin Best?

In our final post of this how to series from Advanced Thermal Solutions we take a slightly different spin on things. This video discusses Zipper Fin for cost effective, high volume deployment while discussing Zipper Fin in contrast with other available heat sink...

ATS webinar on 15th June to address cooling of IoT

Jun 14, 2016

Advanced Thermal Solutions, Inc. Webinar Live: The Impact of Thermal Management In Electronics Design: Wearables, IoT, Data Centers June 15, 2016 – 2PM EST.

The internet of things can be thought of as a solution stack from sensor or wearable device, to the machine-to-machine communication that moves the information from the sensor along the network to the cloud, where computing happens back down to a hand held device like a smartphone or machine system, that takes action with the information. That stack has electronics all along the path. Electronics create heat and all along the IoT stack of Sensor/M2M/Cloud there is opportunity for systems to overheat making the entire IoT stack for a given solution unreliable or completely non-functional. In this live webinar, thermal management of electronics is reviewed and the important role that circuit design plays in mitigating such heat-related challenges is discussed.

Click here to sign up for the webinar