[fusion_vimeo id="111766690" width="" height="" autoplay="false" api_params="" hide_on_mobile="small-visibility,medium-visibility,large-visibility" class=""][/fusion_vimeo] In July, Future Facilities, a CAD software company, released the results of a survey it...
Selection for performance Heat Pipes are often called Heat Superconductors! In this engineering article we'll talk about heat pipes, how they are made, compare them with heat sinks, and talk about performance in various thermal management applications. While reading...
In our final post of this how to series from Advanced Thermal Solutions we take a slightly different spin on things. This video discusses Zipper Fin for cost effective, high volume deployment while discussing Zipper Fin in contrast with other available heat sink...
This is the 3rd post in the ATS how to series. In this week's post, we have a really quick video about applying thermal tape to your heat sinks - Perfect if you have never done this before. More... ATS How-to series How to Make a Thermocouple How to Remove Thermal...
Thermal management videos – Webinars from ATS
Advanced Thermal Solutions (ATS) run a series of training webinars to assist designers and engineers when considering thermal management and regulation. Check out this series of recorded webinars from ATS on thermal interface materials, selecting heat sinks and thermal modelling.
Using thermal interface materials to improve heat sink thermal performance
To cool hotter components, engineers are turning to larger fans and heat sinks and added surface area. But these hardware changes add significant cost to the design. Alternatively, a cooling system’s performance can be improved just by using a better interface material to lower thermal resistance at the interface of the case and the heat sink. Participants will learn to overcome thermal challenges by making simple and cost-effective changes in thermal interface materials.
Basics and options in thermal modelling and analysis of electronics systems
Modeling and simulations are the cornerstone of any successful product launch of electronics products. Engineers are faced with three modeling options, Analytical, Computational and Experimental. In this tutorial, these modeling options are reviewed and their application to a problem domain is discussed.
Heat sink selection made easy
The heat dissipation needs of today’s components are more challenging than ever. Choosing the right heat sink the first time is essential. With so many application requirements and heat sink options, this can be a daunting task, but it is made easier by having an informed approach.
Need more information on thermal management and heat sink applications?
For more information, head over to the ATS page where you can find out more about ATS and its products, as well as request more information, data and samples.